EETIUM, Inc.

From hardware design and development
to parts manufacturing and assembly

Circuit and PCB design, BSP and driver development, in-house AI core boards and manufacturing through our capital and business alliance partners — combined to fit your product.

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Company overview

Hardware development built around your requirements. We combine our in-house AI core boards with the manufacturing base of our capital and business alliance partners to turn your product into reality. Awarded a Certificate of Merit by the Hanoi People’s Committee two years in a row.

About EETIUM

Design & development

From requirements and configuration to circuit and PCB design (up to 12 layers; DDR, MIPI, PCIe), BSP and driver development, and prototyping and manufacturing coordination.

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Manufacturing partnerships

EETIUM holds capital and business alliances with mold-making and precision-machining companies. From prototypes and small lots to mass production — as parts or as finished products.

How we work

Design & development

Designed to your requirements, making use of existing platforms

  1. 01

    Requirements & configuration

    We clarify the use case and functions, and agree whether a new design or one of our AI core boards is the better starting point.

  2. 02

    Circuit & PCB design

    Boards with high-speed signals such as DDR, MIPI and PCIe, up to 12 layers.

  3. 03

    BSP & driver development

    Bootloader, Buildroot and drivers ported and tuned for the board we design.

  4. 04

    Prototyping & manufacturing coordination

    We agree how to prototype and evaluate, and coordinate enclosures and machined parts with our partners.

Scope and deliverables are agreed for each project.

Architecture & component selection

We get involved from the earliest phase and propose the best hardware configuration for your product

  1. 01

    Requirements analysis

    Use case, processing performance, power consumption, cost and production volume.

  2. 02

    Architecture design

    System configuration including SoC, memory, interfaces, power and communication.

  3. 03

    Component selection

    We compare several candidates and select the best fit for your requirements.

  4. 04

    Proposal

    Block diagram, component comparison table and a rough cost estimate.

How we evaluate components

  • Performance & processing capability
  • Power consumption & heat
  • Cost
  • Long-term supply & EOL risk
  • Availability & lead time
  • Certification & standards

Our proposals compare several options, including our own AI core boards.

Consultation on configuration and component selection is free of charge.

In-house products · AI core boards

Boards we designed ourselves, used as a customizable base for each product

AI core boards

Our in-house AI core boards serve as the development base and are customized to your use case, interfaces, size and power conditions.

Detailed specifications of each board are available on request.

Software provided (BSP)

  • Bootloader
  • Buildroot (embedded Linux)
  • Device drivers

With a board support package matched to the board, your team can concentrate on application development.

All photos are EETIUM’s own. Customer products are never photographed or published, in line with our non-disclosure agreements.

Manufacturing through capital and business alliances

EETIUM holds capital and business alliances with mold-making and precision-machining companies

Molds for plastic products

Molds for resin-molded parts are made by our alliance partners.

Precision machining

Machined parts, such as enclosure and mechanical parts, are produced by our alliance partners.

Our partners’ strengths

  • Strong technical capability
  • Production systems compliant with international standards
  • Manufacturing track record for Japan, the US and Europe

Products that meet Japanese quality standards, at the cost of production in Vietnam. Drawing on our partners’ manufacturing experience with Japanese, US and European customers, we discuss manufacturing conditions and prototyping methods from the development stage.

Scope & delivery

From prototypes and small lots to mass production — as parts or as finished products

  1. Design
  2. Prototyping & evaluation
  3. Parts manufacturing
  4. Assembly
  5. Inspection & testing

A · Parts delivery

PCBs, resin-molded parts and machined parts are delivered individually; you carry out assembly and inspection.

Recommended when you want to

  • Carry out assembly and final inspection in Japan
  • Supply parts to an existing production line

B · Finished-product delivery (one-stop)

From design to assembly and functional inspection, shipped as finished products.

Recommended when you want to

  • Entrust everything from development to mass production
  • Reduce the workload of managing procurement and assembly

Supplier management & on-site checks

Our basic principles for working together in development and manufacturing

Items shared for every project

  • 01 Specifications, drawings and changes
  • 02 Quotation conditions, procurement schedule and production progress
  • 03 Inspection items and acceptance criteria
  • 04 Handling of defects and re-verification

Factory & production-line tours

For joint development, we arrange visits so you can see the equipment, processes and products of the factories involved.

Scope and dates of visits are agreed in advance.

We combine the steps you need, from design to manufacturing
PCB Design & Layout

High-speed boards up to 12 layers.

  • High-speed and mixed-signal design
  • Early EMC/EMI countermeasures
  • Design for manufacturing (DFM)

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Customized LCD Screen

Display modules from specification to mass production.

  • Display technology selection (TFT, IPS, OLED, monochrome)
  • Size, interface and touch
  • Hardware and firmware integration

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Firmware Development

MCU, RTOS and embedded Linux.

  • BSP and driver development
  • Peripheral control and communication
  • Board bring-up and debugging

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Software Engineering

Embedded and application software.

  • System integration
  • Performance optimization
  • Updates and new features after delivery

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Electronic Components

Component selection and EOL / lead-time risk.

  • Component selection from the architecture stage
  • BOM review and recommended parts
  • Procurement from prototype to volume

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Edge AI – IoT Hardware

Devices built on our AI core boards.

  • In-house AI core boards
  • BSP provided
  • IoT devices with sensors

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Industrial Design

Enclosures, mechanical design and manufacturability.

  • Exterior design
  • Coordination with PCB design
  • Enclosure prototypes and samples

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Manufacturing

From prototype to volume, with our partners.

  • PCB fabrication and assembly
  • CNC machining and sheet metal
  • Parts or finished-product delivery

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    REQUEST A CALL BACK

    Tell us about your product — an engineer will call you back.

    Prefer to talk first? Leave your details and an EETIUM engineer will contact you. You can also email info@eetium.com or call +84 83 555 9299 (Mon–Fri 9:00–18:00, Vietnam time, UTC+7).

    OUR MISSION

    To build reliable, high-performance technology through uncompromising engineering quality.

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